ZTE demonstrates 5.76Mbps HSUPA at GSMA Mobile World Congress 2008

ZTE demonstrates 5.76Mbps HSUPA at GSMA Mobile World Congress 2008

Shenzhen, China – ZTE, a leading global provider of telecommunications equipment and network solutions, is demonstrating the company’s newly IOT (Inter Operability Testing) tested 5.76Mbps HSUPA (High Speed Uplink Packet Access) network equipment at the GSMA Mobile World Congress Barcelona 2008, Spain. This follows the successful launch of ZTE’s 7.2Mbps HSDPA/2Mbps HSUPA network equipment at China’s PT/Wireless & Networks Comm exhibition in October last year.

HSUPA is a UMTS uplink enhancement technology introduced in 3GPP R6. It has two phases: in phase I the maximum uplink data throughput is 1.9Mbps; in phase II the maximum data throughput is up to 5.76Mbps. HSUPA technology increases capacity and throughput, and improves spectrum efficiency as well, satisfying the growing demand for mobile services in wireless broadband networks.

“We are proud to have completed the 5.76Mbps HSUPA IOT with terminals using Qualcomm chips,” said Fang Hui, ZTE’s General Manager of WCDMA Products. “Our ability to launch the solution at the MWC show further validates our industry leading technology expertise in the HSPA field.”

ZTE’s extensive HSPA R&D programme led to the company’s initial deployment of HSPA in 2004 which featured the foundations of a smooth upgrade path enabling seamless hardware development. This was followed in 2006 by the deployment of 14.4Mbps HSDPA and in 2007 of 7.2 Mbps HSDPA/HSUPA. At the same time ZTE successfully carried out initial IOT tests and implemented interoperability partnerships with other major telecoms equipment vendors.

ZTE’s end-to-end HSPA solution features all-rounded HSPA commercial solutions, HSPA commercial terminals, data cards and HSPA simulating platform software. Today, ZTE’s HSPA technology has been widely deployed across 30 countries and regions including Europe, Asia, and Africa.

ZTE will be exhibiting at stand B127 in Hall 8 at the GSMA Mobile World Congress 2008.