Third generation of connectivity technology promises 10-fold jump in performance

Some of the biggest players in the technology sector have banded together to promote the next generation of USB technology.

The next version of the USB connectivity technology for connecting peripherals to PCs, USB 3.0, has been put forward and promises users a 10-fold jump in performance.

Firms including Microsoft, NEC, Texas Instruments, HP, Intel and NXP Semiconductors, which created the original USB, have now formed the USB 3.0 Promoter Group to create a superspeed version. The group claimed USB 3.0 is needed because digital content files are now too big for fast handling by USB 2.0.

USB 3.0 will target fast sync-and-go transfer applications in the PC, consumer and mobile segments and will be backward compatible. The group is aiming for greater performance to help USB overtake the less popular, but faster, Firewire interconnect. USB 3.0 will also use less power and offer improved protocol efficiency and quality of service when dealing with multiple flows of data.

The completed USB 3.0 specification is expected by the first half of 2008 and the first implementation will be in the form of discrete silicon. The arrival of USB 3.0, sometime in 2009, will no doubt spark the creation of thousands of new PCs, laptops, peripherals and consumer electronics products.

“HP’s commitment to providing customers with a reliable method for connecting peripherals is evident through our support of both USB 2.0 and wireless USB technologies,” said Phil Schultz, vice president of consumer inkjet solutions at HP.

“With USB 3.0 we are creating an even better experience for customers when connecting printers, digital cameras or other peripheral devices to their PCs.”

Patrick Gelsinger, senior vice president and general manager at Intel, added: “Intel worked jointly with industry leaders in the development and adoption of two generations of USB. As the market evolves to support customer demands for storing and moving greater amounts of digital content, we look forward to developing the third generation of USB technology to meet these demands.”

Katsuhiko Itagaki, general manager of SoC systems division at NEC Electronics, said: “NEC has been a supporter of USB technologies since the first installment of wired USB.”

“Now it is time to evolve an already successful interface to meet market demands for moving large amounts of content at faster speeds to minimise users’ waiting time.”